High Vacuum Systems




Magnetron Sputtering Sources
3
6
8
6
Thermische Verdampferquellen
4
4
6
3
Low Temperature Evaporation Sources (LTE)
4
2
2
nicht verfügbar
Elektronenstrahlquelle
nicht verfügbar
Multi Pocket, 5 kW or 10 kW Power Supplies
Multi Pocket, 5 kW or 10 kW Power Supplies
Multi Pocket, 5 kW or 10 kW Power Supplies
Platen
150 mm Substrates
- Heating Up to 350°C
- Water-Cooling
150 mm Substrates
- Heating Up to 800°C
- Water-Cooling
- RF Bias
200 mm Substrates
- Heating Up to 800°C
- Water-Cooling
- RF Bias
Tilting Fixture 200 mm Substrates
- Heating Up to 550°C
- Water-Cooling
- Glimmentladung
Schleusenkammer
nicht verfügbar
Single or Multi-Cassette
Single or Multi-Cassette
Einzel
Software
Full eKLipse™ Control Software/Hardware Suite
Full eKLipse™ Control Software/Hardware Suite
Full eKLipse™ Control Software/Hardware Suite
Full eKLipse™ Control Software/Hardware Suite

NANO 36Affordable Glove Box Integrated Sputtering, Thermal or Low Temperature Evaporation System
Weitere InfosMagnetron Sputtering Sources
3Thermische Verdampferquellen
4Low Temperature Evaporation Sources (LTE)
4Elektronenstrahlquelle
nicht verfügbarPlaten
150 mm Substrates
- Heating Up to 350°C
- Water-Cooling
Schleusenkammer
nicht verfügbarSoftware
Full eKLipse™ Control Software/Hardware Suite
PRO Line PVD 75Modular Design, Allowing Countless Configurations & Multiple Techniques in the Same Chamber
Weitere InfosMagnetron Sputtering Sources
6Thermische Verdampferquellen
4Low Temperature Evaporation Sources (LTE)
2Elektronenstrahlquelle
Multi Pocket, 5 kW or 10 kW Power SuppliesPlaten
150 mm Substrates
- Heating Up to 800°C
- Water-Cooling
- RF Bias
Schleusenkammer
Single or Multi-CassetteSoftware
Full eKLipse™ Control Software/Hardware SuiteMagnetron Sputtering Sources
8Thermische Verdampferquellen
6Low Temperature Evaporation Sources (LTE)
2Elektronenstrahlquelle
Multi Pocket, 5 kW or 10 kW Power SuppliesPlaten
200 mm Substrates
- Heating Up to 800°C
- Water-Cooling
- RF Bias
Schleusenkammer
Single or Multi-CassetteSoftware
Full eKLipse™ Control Software/Hardware Suite
AXXISRadial Deposition Ports & a Right-Angled Tilting Substrate Stage Facilitates Multiple Deposition Techniques
Weitere InfosMagnetron Sputtering Sources
6Thermische Verdampferquellen
3Low Temperature Evaporation Sources (LTE)
nicht verfügbarElektronenstrahlquelle
Multi Pocket, 5 kW or 10 kW Power SuppliesPlaten
Tilting Fixture 200 mm Substrates
- Heating Up to 550°C
- Water-Cooling
- Glimmentladung