Glove Box Interfaced Systems




Magnetron Sputtering Sources
3
6
8
8+
Thermische Verdampferquellen
4
4
6
4
Low Temperature Evaporation Sources (LTE)
4
4
12
12
Elektronenstrahlquelle
nicht verfügbar
Multi Pocket, 5 kW or 10 kW Power Supplies
Multi Pocket, 5 kW or 10 kW Power Supplies
Multi Pocket, 5 kW or 10 kW Power Supplies
Platen
150 mm Substrates
- Heating Up to 350°C
- Water-Cooling
150 mm Round or 100 mm x 100 mm Square Substrates
- Heating Up to 850°C
- Water-Cooling
- RF Bias
200 mm Round or 150 mm x 150 mm Square Substrates
- Heating Up to 850°C
- -10°C Cooling
- RF Bias
- Insitu Mask Changing
- Single/Dual Wedge Tool
200 mm Round or 200 mm x 200 mm Square Substrates
- Heating Up to 850°C
- -10°C Cooling
- RF Bias
- Insitu Mask Changing
- Single/Dual Wedge Tool
Schleusenkammer
nicht verfügbar
Single or Multi-Cassette
Single or Multi-Cassette
Single or Multi-Cassette
Software
Full eKLipse™ Control Software/Hardware Suite
Full eKLipse™ Control Software/Hardware Suite
Full eKLipse™ Control Software/Hardware Suite
Full eKLipse™ Control Software/Hardware Suite

NANO 36Affordable Glove Box Integrated Sputtering, Thermal or Low Temperature Evaporation System
Weitere InfosMagnetron Sputtering Sources
3Thermische Verdampferquellen
4Low Temperature Evaporation Sources (LTE)
4Elektronenstrahlquelle
nicht verfügbarPlaten
150 mm Substrates
- Heating Up to 350°C
- Water-Cooling
Schleusenkammer
nicht verfügbarSoftware
Full eKLipse™ Control Software/Hardware Suite
Mini SPECTROSOrganic Thin Film Deposition & Metallization System up to 100 mm x 100 mm Substrate
Weitere InfosMagnetron Sputtering Sources
6Thermische Verdampferquellen
4Low Temperature Evaporation Sources (LTE)
4Elektronenstrahlquelle
Multi Pocket, 5 kW or 10 kW Power SuppliesPlaten
150 mm Round or 100 mm x 100 mm Square Substrates
- Heating Up to 850°C
- Water-Cooling
- RF Bias
Schleusenkammer
Single or Multi-CassetteSoftware
Full eKLipse™ Control Software/Hardware Suite
SPECTROSOrganic Thin Film Deposition & Metallization System up to 150 mm x 150 mm Substrate
Weitere InfosMagnetron Sputtering Sources
8Thermische Verdampferquellen
6Low Temperature Evaporation Sources (LTE)
12Elektronenstrahlquelle
Multi Pocket, 5 kW or 10 kW Power SuppliesPlaten
200 mm Round or 150 mm x 150 mm Square Substrates
- Heating Up to 850°C
- -10°C Cooling
- RF Bias
- Insitu Mask Changing
- Single/Dual Wedge Tool
Schleusenkammer
Single or Multi-CassetteSoftware
Full eKLipse™ Control Software/Hardware Suite
Super SPECTROSOrganic Thin Film Deposition & Metallization System up to 200 mm x 200 mm Substrate
Weitere InfosMagnetron Sputtering Sources
8+Thermische Verdampferquellen
4Low Temperature Evaporation Sources (LTE)
12Elektronenstrahlquelle
Multi Pocket, 5 kW or 10 kW Power SuppliesPlaten
200 mm Round or 200 mm x 200 mm Square Substrates
- Heating Up to 850°C
- -10°C Cooling
- RF Bias
- Insitu Mask Changing
- Single/Dual Wedge Tool