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Thin Films Systems
Dünnschicht-Systeme

High Vacuum Systems
NANO 36™

Compact, full-featured computer controlled PVD tool.

PRO Line PVD Series

R&D, Pilot-production, and production tools.

AXXIS™

Glancing Angle Deposition systems.

Ultra High Vacuum Systems
LAB Line

Ultra-High vacuum sputtering systems (10-10 Torr), with up to 15 cathodes. Electron Beam and thermal options available.

CMS Series

Combinatorial Materials Science tool, specifically designed for electron-beam or sputtering applications.

Glove Box Interfaced Systems
NANO 36™

Compact, full-featured computer controlled PVD tool.

SPECTROS™ Serie

Glovebox integrated Sputtering, Electron Beam, Thermal, & Organic Evaporation Deposition.

Custom Deposition Systems
Kundenspezifische Vakuumsysteme

Customized solutions for pioneering applications such as TVAC/space simulation, Diamond Like coatings, etc.

Cluster Deposition Systems
OCTOS™

Robotic sample transfer system with up to 10 process modules; Including PVD, ALD, Organics, PLD, CVD, etch; insitu analysis and glovebox options.

Production Systems
BATCH Coaters

Linear batch coaters, and multi-substrate dome coaters for high-throughput applications.

KDF In-Line Solutions

KDF systems can be customized to cover mainstream silicon, emerging materials and flat panel display markets.

Atomlagendepositionssysteme
ALD150LE™

Thermal Atomic Layer Deposition.

ALD150LX™

Thermal or Plasma-enhanced, load locked Atomic Layer Deposition System.

The Right System for Your Research

The Right System for Your Research

Anwendungsforschung
Anwendungsforschung
Perovskite Thin Films for Photovoltaics & Electronics Superconducting PVD Thin Films for Quantum Applications; Qubits & Josephson Junctions PVD of Magnetic Thin Films: Spintronics, GMR & TMR Thin Films & Heusler Alloys
Solid-State Lithium Thin Film Batteries Organic Electronics (OLEDs & OPVs) Reactive Sputtering Research
PVD of Indium Bumps Thin Film Deposition for Lift-Off Processes Physical Vapor Deposition for Medical Devices
Wir unterstützen Sie in folgenden Anwendungsbereichen:

Wir unterstützen Sie in folgenden Anwendungsbereichen:

Techniken und Fähigkeiten
Techniken und Fähigkeiten
Electron Beam Evaporation Thermal Evaporation Magnetron Sputtering
Organic (Point Source) Evaporation ALD (Atomic Layer Deposition) Multi-Chamber
Glove Box Integration Pulsed Filtered Cathodic Arc Deposition HiPIMS
Techniques That Drive Your Process

Techniques That Drive Your Process

Thin Film Knowledge Base
Thin Film Knowledge Base
Magnetron Performance Optimization Guide Evaporation Process Notes by Material Vacuum Reference Tables Vacuum Technology Concepts Calculators & Conversion Tools Frequently Asked Questions Material Deposition Chart Vacuum Technical Information
Service & Support für Systeme
System Service & Support
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Ultra High Vacuum Systems

LAB Line
CMS (Combinatorial Materials Science) Series

LAB Line

High-Performance UHV Platform Optimized for Magnetron Sputtering Applications

CMS (Combinatorial Materials Science) Series

Advanced Research System Utilizing Sputtering or Electron Beam Techniques

Ultrahochvakuum

Fully Bakeable

nicht verfügbar

Magnetron Sputtering Sources

12

6+

Elektronenstrahlquelle

nicht verfügbar

Multi Pocket, 5 kW or 10 kW Power Supplies

Platen

150 mm Substrates

  • Heating Up to 1000°C
  • Water-Cooling
  • RF Bias

200 mm Substrates

  • Heating Up to 1100°C
  • Water-Cooling
  • RF Bias

Schleusenkammer

Single or Multi-Cassette

Single or Multi-Cassette

Software

Full eKLipse™ Control Software/Hardware Suite

Full eKLipse™ Control Software/Hardware Suite

LAB Line

LAB LineHigh-Performance UHV Platform Optimized for Magnetron Sputtering Applications

Weitere Infos

Ultrahochvakuum

Fully Bakeable

Magnetron Sputtering Sources

12

Elektronenstrahlquelle

nicht verfügbar

Platen

150 mm Substrates

  • Heating Up to 1000°C
  • Water-Cooling
  • RF Bias

Schleusenkammer

Single or Multi-Cassette

Software

Full eKLipse™ Control Software/Hardware Suite
CMS (Combinatorial Materials Science) Series

CMS (Combinatorial Materials Science) SeriesAdvanced Research System Utilizing Sputtering or Electron Beam Techniques

Weitere Infos

Ultrahochvakuum

nicht verfügbar

Magnetron Sputtering Sources

6+

Elektronenstrahlquelle

Multi Pocket, 5 kW or 10 kW Power Supplies

Platen

200 mm Substrates

  • Heating Up to 1100°C
  • Water-Cooling
  • RF Bias

Schleusenkammer

Single or Multi-Cassette

Software

Full eKLipse™ Control Software/Hardware Suite
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